Bonded Pendulum Valve Plate

Pendulum valve control systems are now commonly used on major Etch and Thin Films semiconductor manufacturing equipment for downstream pressure control and isolation.

However, the original design uses standard O-rings that are prone to premature failure from mechanical degradation. Our custom engineered bonded seal solution significantly prolongs seal life by optimizing sealing stresses, mechanical loading, and dynamic sealing force retention. This results in longer tool uptime between PMs. DN100(4″) and DN250(10″) sizes are both currently available.